Acoustic And Thermal Isolation Performance Comparison Between Recycled And Ceramic Roof Tiles Using Digital Holographic Interferometry
Autor: | A. Araceli Sánchez, I. Manuel H. De la Torre, S. Fernando Mendoza, R. Cesar Tavera, R. Manuel de J. Briones |
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Jazyk: | angličtina |
Rok vydání: | 2016 |
Předmět: | |
DOI: | 10.5281/zenodo.1112201 |
Popis: | Recycling, as part of any sustainable environment, is continuously evolving and impacting on new materials in manufacturing. One example of this is the recycled solid waste of Tetra Pak ™ packaging, which is a highly pollutant waste as it is not biodegradable since it is manufactured with different materials. The Tetra Pak ™ container consists of thermally joined layers of paper, aluminum and polyethylene. Once disposed, this packaging is recycled by completely separating the paperboard from the rest of the materials. The aluminum and the polyethylene remain together and are used to create the poly-aluminum, which is widely used to manufacture roof tiles. These recycled tiles have different thermal and acoustic properties compared with traditional manufactured ceramic and cement tiles. In this work, we compare a group of tiles using nondestructive optical testing to measure the superficial micro deformations of the tiles under well controlled experiments. The results of the acoustic and thermal tests show remarkable differences between the recycled tile and the traditional ones. These results help to determine which tile could be better suited to the specific environmental conditions in countries where extreme climates, ranging from tropical, desert-like, to very cold are experienced throughout the year. {"references":["R. M. E. Diamant, Thermal and Acoustic Insulation, Butterworth-Heinemann (2014).","Osama A. B. Hassan, Building Acoustics and Vibration: Theory and Practice, World Scientific, 2009","Matheos Santamouris, Solar Thermal Technologies for Buildings: The State of the Art, Earthscan, 2003.","F. Mendoza Santoyo, G. Pedrini, S. Schendin, and H. J. Tiziani, \"3D displacement measurements of vibrating objects with multi-pulse digital holography,\" Meas. Sci. Technol. 10, 1305–1308 _1999_.","Carlos Pérez-López, Manuel H. De la Torre-Ibarra and Fernando Mendoza Santoyo, \"Very high speed cw digital holographic interferometry\", Opt. Express 14(21), 9709–9715 (2006).","R. S. Sirohi and F. S. Chau, Optical Methods of Measurement: Wholefield Techniques (Marcel Dekker, New York, 1999).","K. J. Gåsvik, Optical Metrology, (John Wiley & Sons Ltd., Chichester, 2002).","P. K. Rastogi and D. Inaudi, Trends in Optical Nondestructive Testing and Inspection (Elsevier, Amsterdam, 2000).","T. Saucedo Anaya, M. De la Torre, and F. Mendoza Santoyo, \"Endoscopic pulsed digital holography for 3D measurements\", Opt. Express 14(4), 1468–1475 (2006).\n[10]\tTonatiuh Saucedo-A., M. H. De la Torre-Ibarra, F. Mendoza Santoyo, Ivan Moreno, \"Digital holographic interferometer using simultaneously three lasers and a single monochrome sensor for 3D displacement measurements\", Opt. Express 18(19), 19867–19875 (2010).\n[11]\tAraceli Sánchez A., M. De la Torre-Ibarra, F. Mendoza-Santoyo, S. A. Tonatiuh, Donato Reyes R., \"Simultaneous 3D digital holographic interferometry for strain measurements validated with FEM\", Opt Laser Eng 52, 178–183 (2014). DOI: 10.1016/j.optlaseng.2013.06.013.\n[12]\tU. Schnars and W. Jueptner, Digital Holography, (Springer-Verlag Berlin Heidelberg 2005).\n[13]\tRapp, D., \"The Dimensional Stability of Materials\", JPL D-7667 (1990). \n[14]\tWolff, E.G., Introduction to the Dimensional Stability of Composite Materials, DEStech Publications, Lancaster PA (2004).\t\n[15]\tT. Kreis, Hand book of holographic Interferometry (Wiley-VCH, Germany, 2005).\n[16]\tM. Takeda, H. Ina, and S. Kobayashi, \"Fourier-transform method of fringe pattern analysis for computer based topography and interferometry,\" J. Opt. Soc. Am. 72(1), 156–160 (1982).\n[17]\tS.P Sukhatme and J.K Nayak, Solar Energy; Principle of Thermal Collection and Storage, Third Edition, Tata McGraw-Hill Publishing Company Limited. ISBN (13): 978-0-07-026064-1 (2008)."]} |
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