Large-payload climbing in complex vertical environments using thermoplastic adhesive bonds
Autor: | Fumiya Iida, Lina Graber, Liyu Wang |
---|---|
Rok vydání: | 2013 |
Předmět: |
chemistry.chemical_classification
0209 industrial biotechnology Thermoplastic Materials science Adhesive bonding business.industry Payload Terrain Ranging 02 engineering and technology Structural engineering 021001 nanoscience & nanotechnology Computer Science Applications 020901 industrial engineering & automation chemistry Control and Systems Engineering Climbing Range (aeronautics) Adhesive Electrical and Electronic Engineering Aerospace engineering 0210 nano-technology business |
Zdroj: | IEEE Transactions on Robotics |
DOI: | 10.1109/TRO.2013.2256312 |
Popis: | Despite many approaches proposed in the past robotic climbing in a complex vertical environment is still a big challenge. We present here an alternative climbing technology that is based on thermoplastic adhesive (TPA) bonds. The approach has a great advantage because of its large payload capacity and viability to a wide range of flat surfaces and complex vertical terrains. The large payload capacity comes from a physical process of thermal bonding while the wide applicability benefits from rheological properties of TPAs at higher temperatures and intermolecular forces between TPAs and adherends when being cooled down. A particular type of TPA has been used in combination with two robotic platforms featuring different foot designs including heating/cooling methods and construction of footpads. Various experiments have been conducted to quantitatively assess different aspects of the approach. Results show that an exceptionally high ratio of 500 between dynamic payloads and body mass can be achieved for stable and repeatable vertical climbing on flat surfaces at a low speed. Assessments on four types of typical complex vertical terrains with a measure i.e. terrain shape index ranging from 0.114 to 0.167 return a universal success rate of 80 100. © 2004 2012 IEEE. |
Databáze: | OpenAIRE |
Externí odkaz: |