Microstructural Control of the Interface Layer for Strength Enhancement of Dissimilar Al/Cu Joints via Ni Addition during TIG Arc Brazing
| Autor: | Hiroyuki Kokawa, Yutaka S. Sato, Sakiko Yabu, Hiroki S. Furuya |
|---|---|
| Jazyk: | angličtina |
| Rok vydání: | 2021 |
| Předmět: |
lcsh:TN1-997
Materials science Intermetallic chemistry.chemical_element 02 engineering and technology Tungsten 01 natural sciences 0103 physical sciences dissimilar metal joining Brazing General Materials Science Composite material Inert gas lcsh:Mining engineering. Metallurgy 010302 applied physics Gas tungsten arc welding Metals and Alloys 021001 nanoscience & nanotechnology Microstructure Copper chemistry copper aluminum alloy 0210 nano-technology Layer (electronics) intermetallic compound |
| Zdroj: | Metals Volume 11 Issue 3 Metals, Vol 11, Iss 491, p 491 (2021) |
| ISSN: | 2075-4701 |
| DOI: | 10.3390/met11030491 |
| Popis: | Dissimilar metal joining between Al and Cu is effective for reducing the weight and cost of electrical components. In this study, dissimilar lap joining of pure Al to pure Cu with an Al-Ni filler material was conducted using tungsten inert gas (TIG) arc brazing, and the effect of Ni on the joint strength associated with the microstructure of the intermetallic compound (IMC) layer at the dissimilar interface was examined. The addition of Ni effectively increased the interfacial strength of the joints. Regardless of the addition of Ni, the joints fractured in the thick Al2Cu layer formed at the Al/Cu interface. However, the Ni addition reduced the thickness of the IMC layer and led to the formation of Al7Cu4Ni particles in the weakest Al2Cu layer. Both the thickness reduction and reinforcing Al7Cu4Ni particle formation are thought to contribute to the increase in joint strength of the Al/Cu dissimilar interface. |
| Databáze: | OpenAIRE |
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