Laser-Induced Silver Seeding on Filter Paper for Selective Electroless Copper Plating

Autor: Jin Cheng, Zhijie Gu, Chang-Chun Liu, Kenji Ogino, Xiaoqiang Li
Jazyk: angličtina
Rok vydání: 2018
Předmět:
Materials science
chemistry.chemical_element
02 engineering and technology
Substrate (electronics)
010402 general chemistry
lcsh:Technology
01 natural sciences
copper pattern
Article
Metal
chemistry.chemical_compound
flexible printed circuit board
Copper plating
General Materials Science
lcsh:Microscopy
electroless plating
lcsh:QC120-168.85
chemistry.chemical_classification
lcsh:QH201-278.5
Filter paper
lcsh:T
Polyacrylonitrile
laser-induced irradiation
Polymer
021001 nanoscience & nanotechnology
Copper
Flexible electronics
0104 chemical sciences
chemistry
Chemical engineering
lcsh:TA1-2040
visual_art
visual_art.visual_art_medium
lcsh:Descriptive and experimental mechanics
lcsh:Electrical engineering. Electronics. Nuclear engineering
lcsh:Engineering (General). Civil engineering (General)
0210 nano-technology
lcsh:TK1-9971
Zdroj: Materials
Materials, Vol 11, Iss 8, p 1348 (2018)
Volume 11
Issue 8
ISSN: 1996-1944
Popis: The generation of a flexible printed circuit board on polymer fabrics has been a challenge over the last decade. In this work, a copper pattern was obtained on a soft substrate of filter paper/polyacrylonitrile (FP/PAN) film, where the filter paper was commercially available. The pattern of Ag particles was first produced on an Ag+-doped FP/PAN composite film, followed by electroless plating of copper using the metal silver particles as seeds. The in situ reduction of silver particles and the formation of the silver agglomeration pattern were induced by laser irradiation technology on the FP/PAN/AgNO3 composite film. A variety of characterizations indicated that the resultant copper deposition was uniform, with good conductivity properties.
Databáze: OpenAIRE
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