Stress Measurement in Thin Films Using Wafer Curvature: Principles and Applications

Autor:	Eric Chason
Rok vydání:	2019
Předmět:	010302 applied physics Materials science business.industry 0103 physical sciences Wafer curvature Optoelectronics Stress measurement 02 engineering and technology Thin film 021001 nanoscience & nanotechnology 0210 nano-technology business 01 natural sciences
Zdroj:	Handbook of Mechanics of Materials ISBN: 9789811068553 Handbook of Mechanics of Materials
DOI:	10.1007/978-981-10-6884-3_49
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_dedup___::01a9963eb0bad2076f3a2b14055ae577 https://doi.org/10.1007/978-981-10-6884-3_49 Zobrazit plný text záznamu