A Throughput Study for Channel Bonding in IEEE 802.11ac Networks
| Autor: | Mun-Suk Kim, Nada Golmie, SuKyoung Lee, Tanguy Ropitault |
|---|---|
| Rok vydání: | 2019 |
| Předmět: |
business.industry
Computer science 020302 automobile design & engineering 020206 networking & telecommunications Throughput 02 engineering and technology Channel bonding Article Computer Science Applications 0203 mechanical engineering IEEE 802.11b-1999 IEEE 802.11ac Modeling and Simulation Wireless lan Computer Science::Networking and Internet Architecture 0202 electrical engineering electronic engineering information engineering Electronic engineering State (computer science) Electrical and Electronic Engineering business Throughput (business) Computer network |
| Zdroj: | IEEE communications letters : a publication of the IEEE Communications Society. 21 |
| ISSN: | 1089-7798 |
| Popis: | Several analytical models for the channel bonding feature of IEEE 802.11ac have previously been presented for performance estimation, but their accuracy has been limited by the assumptions that there are no collisions or all nodes are in saturated state. Therefore, in this letter, we develop an analytical model for the throughput performance of channel bonding in IEEE 802.11ac, considering the presence of collisions under both saturated and non-saturated traffic loads, and our numerical results were validated by a simulation study. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|