Junction temperature measurements via thermo-sensitive electrical parameters and their application to condition monitoring and active thermal control of power converters
| Autor: | Nick Baker, Yvan Avenas, Laurent Dupont, Marco Liserre |
|---|---|
| Přispěvatelé: | Garcia, Sylvie, Aalborg University [Denmark] (AAU), Laboratoire des Technologies Nouvelles (IFSTTAR/LTN), Institut Français des Sciences et Technologies des Transports, de l'Aménagement et des Réseaux (IFSTTAR), Laboratoire de Génie Electrique de Grenoble (G2ELab), Université Joseph Fourier - Grenoble 1 (UJF)-Centre National de la Recherche Scientifique (CNRS)-Institut Polytechnique de Grenoble - Grenoble Institute of Technology-Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP ), Département Optique (OPT), Institut Mines-Télécom [Paris] (IMT)-Télécom Bretagne-Université européenne de Bretagne - European University of Brittany (UEB), Université Joseph Fourier - Grenoble 1 (UJF)-Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP )-Institut Polytechnique de Grenoble - Grenoble Institute of Technology-Centre National de la Recherche Scientifique (CNRS) |
| Rok vydání: | 2013 |
| Předmět: |
Junction temperature
Computer science TEMPERATURE MEASUREMENT ELECTRONIQUE 02 engineering and technology 01 natural sciences Temperature measurement JUNCTION TEMPERATURE Power semiconductor devices Operating temperature MESURE DE TEMPERATURE Power electronics 0103 physical sciences 0202 electrical engineering electronic engineering information engineering Electronic engineering POWER SEMICONDUCTOR DEVICES Power semiconductor device SEMICONDUCTEUR ComputingMilieux_MISCELLANEOUS 010302 applied physics Temperature control THERMO-SENSITIVE ELECTRICAL PARAMETER (TSEP) POWER ELECTRONICS [SPI.NRJ]Engineering Sciences [physics]/Electric power 020208 electrical & electronic engineering Condition monitoring [SPI.TRON]Engineering Sciences [physics]/Electronics Thermo-sensitive electrical parameter (TSEP) Power module PUISSANCE [SPI.NRJ] Engineering Sciences [physics]/Electric power |
| Zdroj: | IECON IECON 2013-39th Annual Conference of the IEEE Industrial Electronics Society IECON 2013-39th Annual Conference of the IEEE Industrial Electronics Society, Nov 2013, Vienne, Austria. p. 942-948, ⟨10.1109/IECON.2013.6699260⟩ Baker, N, Liserre, M, Dupont, L & Avenas, Y 2013, Junction temperature measurements via thermo-sensitive electrical parameters and their application to condition monitoring and active thermal control of power converters . in Proceedings of the 39th Annual Conference of the IEEE Industrial Electronics Society, IECON 2013 ., 6699260, IEEE Press, Proceedings of the Annual Conference of the IEEE Industrial Electronics Society, pp. 942-948, 39th Annual Conference of the IEEE Industrial Electronics Society, Wien, Austria, 10/11/2013 . https://doi.org/10.1109/IECON.2013.6699260 Annual Conference of the IEEE Industrial Electronics Society, IECON Annual Conference of the IEEE Industrial Electronics Society, IECON, 2013, Vienne, Austria. pp.942-948 |
| DOI: | 10.1109/iecon.2013.6699260 |
| Popis: | IECON 2013 - 39th Annual Conference of the IEEE Industrial Electronics Society , Vienne, AUTRICHE, 10-/11/2013 - 13/11/2013; The temperature of a power semiconductor device is important for both its optimal operation and reliability. If the temperature is known during the operation of a converter, it can be used to monitor the health of power modules: a measurement of aging, scheduling of maintenance, or even implementation of active thermal control to reduce losses and increase lifetime can be performed given an accurate knowledge of temperature. Temperature measurements via thermo-sensitive electrical parameters (TSEP) are one way to carry out immediate temperature readings on fully packaged devices. However, successful implementation of these techniques during the actual operation of a device has not yet been achieved. This paper provides an overview of literature where the usage of TSEPs has been hypothesised or realised in realistic power electronic converter setups. Barriers and limitations preventing wider scale implementation of these methods are discussed. Their potential use in the aforementioned goals in condition monitoring and active thermal control is also described. |
| Databáze: | OpenAIRE |
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