A combined electrolyte for anodizing and copper plating of aluminum and its alloys

Autor:	V. I. Naumov, T. I. Devyatkina, V. V. Rogozhin, T. V. Markova, M. G. Mikhalenko
Rok vydání:	2014
Předmět:	Anodizing Chemistry General Chemical Engineering Metallurgy chemistry.chemical_element Sulfuric acid General Chemistry Electrolyte Crystal structure Copper chemistry.chemical_compound Aluminium Copper plating Electroplating
Zdroj:	Russian Journal of Applied Chemistry. 87:1659-1664
ISSN:	1608-3296 1070-4272
DOI:	10.1134/s1070427214110159
Popis:	The formulation of an effective combined electrolyte for anodizing and copper plating of aluminum and its alloys, characterized by decreased concentration of harmful components (sulfuric acid, copper sulfate), was developed. To obtain copper deposits of finely crystalline structure, introduction of fluorides into the electrolyte was suggested. The optimum operation conditions for the electrolyte were determined. The electroplated copper coatings exhibit high adhesion to the aluminum support without additional heat treatment, which allows considerable reduction of the process time, especially when depositing multilayered coatings, and saving of expendable materials.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::ffadad9f26f79379e178a93893ea9bcb https://doi.org/10.1134/s1070427214110159 Zobrazit plný text záznamu Full text from SpringerLink