Interface evolution of Cu–Ni–Si/Al–Mg–Si clad composite wires after annealing
| Autor: | Yanfeng Li, Xiang-Qian Yin, Yang Zhen, Li-Jun Peng, Xu-Jun Mi, Guo-Jie Huang, Xue Feng, Haofeng Xie |
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| Rok vydání: | 2018 |
| Předmět: |
Materials science
Annealing (metallurgy) 020502 materials Composite number Metals and Alloys Nucleation Intermetallic 02 engineering and technology Activation energy Condensed Matter Physics Microstructure 0205 materials engineering Transmission electron microscopy Materials Chemistry Physical and Theoretical Chemistry Deep drawing Composite material |
| Zdroj: | Rare Metals. 39:1419-1424 |
| ISSN: | 1867-7185 1001-0521 |
| DOI: | 10.1007/s12598-018-1073-3 |
| Popis: | Interface microstructures of Cu–Ni–Si/Al–Mg–Si clad composite wires during isothermal annealing from 623 to 773 K were investigated. The composite wires were fabricated by a drawing process. The evolution of intermetallic compounds (IMCs) was analyzed. A continuous IMCs layer forms only after annealing for 1 min, which may be due to more IMCs nucleation points generated by deep drawing process. IMCs consist of Al4Cu9, AlCu and Al2Cu identified by energy-dispersive spectroscopy (EDS) and transmission electron microscopy (TEM). The growth activation energies of total IMCs, Al2Cu, AlCu and Al4Cu9, are 98.8, 69.4, 101.3 and 137.1 kJ·mol−1, respectively. The higher growth activation energy of Al4Cu9 results in the higher growth rate under high temperature. However, the average interdiffusion coefficient for each IMC calculated by Wagner method shows that interdiffusion in Al2Cu and AlCu is more active than that in Al4Cu9. The higher growth rate of Al4Cu9 may be caused by the long concentration range. |
| Databáze: | OpenAIRE |
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