Preparation Of Low-Density Xerogels At Ambient Pressure For Low K Dielectrics

Autor:	Douglas M. Smith, C.-C. Cho, G. P. Johnston, J. Anderson, S. P. Jeng
Rok vydání:	1995
Předmět:	Capillary pressure Bulk modulus Materials science business.industry Supercritical drying Microelectronics Thermal stability Dielectric Composite material business Shrinkage Ambient pressure
Zdroj:	MRS Proceedings. 381
ISSN:	1946-4274 0272-9172
DOI:	10.1557/proc-381-261
Popis:	Low density silica xerogels have many properties which suggest their use as a low dielectric constant material. Recent process improvements to control capillary pressure and strength by employing aging and pore chemistry modification, such that shrinkage is minimal during ambient pressure drying, have eliminated the need for supercritical drying. Although xerogels offer advantages for intermetal dielectric (IMD) applications because of their low dielectric constant (
Databáze:	OpenAIRE
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