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3D PLUS has developed in the framework of RD activities a new high-performance and high-resolution CMOS camera head for space applications. With the collaboration of the Centre National d’Etudes Spatiales (CNES), also called French Space Agency, which is leading this development, the 12 Mpixels 3DCM800 Space Camera Head is integrated using 3D PLUS technology and expertise in designing high performances and high reliability electronics modules. This development intends to offer the best compromise for a highly miniaturized, highly reliable, all-in-one optoelectronic module solution for space applications. Particular attention has been paid to ensure radiation tolerance to cover a wide range of application such as planetology, equipment monitoring, in-flight spacecraft navigation and rendezvous application, and earth observation applications. Technological developments were necessary to overcome challenges such as heat dissipation, and mechanical assembly of complex components, as will be presented in this paper. |
