Multi-Physics Modeling and Characterization of Components on Flexible Substrates
| Autor: | Chirag Mehta, Tsung-Ching Huang, Sridhar Sivapurapu, Mohamed Lamine Faycal Bellaredj, Madhavan Swaminathan, Rui Chen, Yi Zhou, Suresh K. Sitaraman, Paul A. Kohl, Xiaotong Jia |
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| Rok vydání: | 2019 |
| Předmět: |
010302 applied physics
Bending (metalworking) business.industry Wearable computer 02 engineering and technology 021001 nanoscience & nanotechnology Inductor 01 natural sciences Industrial and Manufacturing Engineering Finite element method Microstrip Electronic Optical and Magnetic Materials Electric power transmission 0103 physical sciences Electronic engineering Electronics Electrical and Electronic Engineering 0210 nano-technology business Wearable technology |
| Zdroj: | IEEE Transactions on Components, Packaging and Manufacturing Technology. 9:1730-1740 |
| ISSN: | 2156-3985 2156-3950 |
| Popis: | Due to the increased popularity of wearable devices, designing flexible hybrid electronics (FHE) is becoming increasingly critical. Some emerging systems that require FHE include wearables, energy-harvesting devices, sensory networks, and electrocardiogram monitors. These systems require designers to account for different flexible actions, such as stretching, bending, twisting, etc. Accounting for different flexible actions requires models for different components that capture the behavior under these actions. This work focuses on characterizing the effects of bending two components, namely, printed microstrip transmission lines and power inductors. In this work, both the mechanical and electrical aspects are captured specifically for aerosol jet-printed (AJP) transmission lines, screen-printed (SP) transmission lines, and SP power inductors on flexible substrates using 3-D finite element modeling (FEM), which are then correlated with the measurements. The challenges in such multi-physics modeling and measurements are discussed, including the effect of bending. |
| Databáze: | OpenAIRE |
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