| Autor: |
Xing-Chang Wei, En-Xiao Liu, Eng-Kee Chua, R. Vahldieck, Er-Ping Li, Zaw-Zaw Oo |
| Rok vydání: |
2008 |
| Předmět: |
|
| Zdroj: |
IEEE Transactions on Advanced Packaging. 31:536-543 |
| ISSN: |
1521-3323 |
| DOI: |
10.1109/tadvp.2008.927841 |
| Popis: |
A novel method based on hybrid integral equation for electromagnetic emission and susceptibility modeling of power-ground planes with a finite size is proposed in this paper. First, the entire computational domain is divided into the internal subdomain including the substrate sandwiched between the power and ground planes and the external subdomain surrounding the power-ground planes. The internal subdomain is modeled by using the integral equation with dyadic Green's functions of the rectangular cavity, while the free-space Green's function is used to model the outside subdomain. These two kinds of integral equations are coupled through the equivalent electric and magnetic currents that are placed on the interfaces. The key advantage of this proposed method is its ability to model both emission and susceptibility problems. This method can accurately simulate the impedance of the power-ground planes and the radiated field. In particular, it is able to predict the induced electric currents inside the power-ground planes that result from external interference sources. Therefore, this technique is able to provide a complete solution for the electromagnetic compatibility analysis of the system-level package. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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