Effect of Plasma Cleaning Process in the Wettability of Flip Chip PBGA Substrate of Integrated Circuit Packages

Autor:	Nowshad Amin, Ibrahim Ahmad, Ang Ye Cheah
Rok vydání:	2010
Předmět:	Multidisciplinary Materials science Plasma cleaning business.industry Process (computing) Substrate (printing) Integrated circuit law.invention law Electronic engineering Optoelectronics Integrated circuit packaging Wetting business Flip chip
Zdroj:	Journal of Applied Sciences. 10:772-776
ISSN:	1812-5654
DOI:	10.3923/jas.2010.772.776
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::ff54e75aa0422f14f5ae86ff65681864 https://doi.org/10.3923/jas.2010.772.776 Zobrazit plný text záznamu