| Autor: |
Jung-Ryul Lee, Soo-Hyun Eom, Dae Sung Son, Chang Kyu Park, Jae Hoon Lim, Chun Myung Park, Seong-Jin Kim |
| Rok vydání: |
2020 |
| Předmět: |
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| Zdroj: |
Active and Passive Smart Structures and Integrated Systems IX. |
| DOI: |
10.1117/12.2558351 |
| Popis: |
Measuring with strain gages has a limitation of consuming time to prepare for the experiment and attaching near the MLCCs, making it does not represent the physical quantities of the MLCCs itself. In this study, we propose a ‘failure criteria for a crack in MLCCs soldered on a Print-Circuit-Board by ball drop test’ based on the acceleration measured by Laser Doppler Vibrometers. By drawing a Shock Response Spectrum, we can find the dominant frequency for the failure of MLCCs. In addition, we present a suitable deformation form of the Print-Circuit-Board by using a high-speed camera. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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