Development of Copper Materials and Processing for Printed Electronics

Autor:	Takaaki Noudou, Kyoko Kuroda, Maki Inada, Hideo Nakako, Yasushi Kumashiro
Rok vydání:	2012
Předmět:	Materials science chemistry Printed electronics Screen printing Sintering chemistry.chemical_element Electronics Composite material Copper Electrical conductor Layer (electronics) Dispersant
Zdroj:	Transactions of The Japan Institute of Electronics Packaging. 5:20-25
ISSN:	1884-8028 1883-3365
DOI:	10.5104/jiepeng.5.20
Popis:	New material technologies for screen printing electronics were studied. A novel conductive paste which can be metallized at 180°C under reactive gas condition was developed using needle-shaped copper compound particles without any dispersant, protective agents or binder resins. The obtained conductive trace of dense 1.5 μm thick Cu layer with a crystal structure showed the volume resistivity of 2.4 μΩ∙cm and excellent reliability. The metallization mechanism and excellent electrical performance were concluded to be different from those of the sintering.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::ff37bad95853c7afe140a4013998534d https://doi.org/10.5104/jiepeng.5.20 Zobrazit plný text záznamu