Influence of Nano-3%Al2O3 on the Properties of Low Temperature Sn-58Bi (SB) Lead-free Solder Alloy

Autor:	M.N. Ervina Efzan, Rajkumar Durairaj, A. Niakan, S Amares
Rok vydání:	2017
Předmět:	010302 applied physics Materials science Metallurgy Intermetallic Electronic packaging 02 engineering and technology 021001 nanoscience & nanotechnology Microstructure 01 natural sciences Contact angle 0103 physical sciences Vickers hardness test Nano Lamellar structure Wetting 0210 nano-technology
Zdroj:	IOP Conference Series: Materials Science and Engineering. 205:012002
ISSN:	1757-899X 1757-8981
Popis:	This work studies the melting temperature, wettability, metallurgical and hardness properties of the Sn-58Bi (SB) lead-free solder alloy incorporated with nano-3%Al2O3. The melting temperature was observed at 143.44°C upon the additions of the nano-3%Al2O3 with a low contact angle of 20.4°. A well-distributed microstructure with narrower lamellar structure and finer intermetallic compounds and Sn grains was detected for the nano-3%Al2O3 added SB solder alloy. Hardness evaluation based on the Vickers hardness value was as high as 17.1Hv. Overall, the Sn-58Bi + 3% Al2O3 solder alloy appears to harvest beneficial results for these properties and can be used as potential replacement in the current electronic packaging industry.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::ff1f46ba839ba9f71d4b2f64bb852dff https://doi.org/10.1088/1757-899x/205/1/012002 Zobrazit plný text záznamu