Process for in-plane and out-of-plane single-crystal-silicon thermal microactuators
| Autor: | Nadim I. Maluf, Kurt E. Petersen, Erno H. Klaassen, John Logan, J. Mark Noworolski |
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| Rok vydání: | 1996 |
| Předmět: |
Fusion
Materials science Silicon business.industry Metals and Alloys Process (computing) chemistry.chemical_element Condensed Matter Physics Upper and lower bounds Computer Science::Other Surfaces Coatings and Films Electronic Optical and Magnetic Materials Computer Science::Robotics In plane chemistry Computer Science::Systems and Control Comb drive Thermal Electronic engineering Optoelectronics Electrical and Electronic Engineering Actuator business Instrumentation |
| Zdroj: | Sensors and Actuators A: Physical. 55:65-69 |
| ISSN: | 0924-4247 |
| DOI: | 10.1016/s0924-4247(96)01251-4 |
| Popis: | A process to manufacture single-crystal thermal actuators using silicon fusion bonding and electrochemical etch stop is presented. The process permits the simultaneous creation of in-plane and out-of-plane thermal actuators together with levers suitable for both directions of actuation. A final dry-release step is used, permitting the manufacture of MOS or bipolar devices in conjunction with actuators. Out-of-plane actuation of vertically levered devices has been demonstrated. The −3 dB response frequency of out-of-plane actuators is approximately 1000 Hz in air. Novel levered in-plane devices which achieve deflections of up to 200 μm have been fabricated. An estimate of the upper bound of thermal actuator efficiency is presented. |
| Databáze: | OpenAIRE |
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