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PurposeEmbedded passives account for a very large part of today's electronic assemblies. This is particularly true for products such as cellular phones, camcorders, computers, and several critical defence devices. Market pressures for new products with more features, smaller size and lower cost demand smaller, compacter, simpler substrates. An obvious strategy is to reduce the number of surface mounted passives by embedding them in the substrate. In addition, current interconnect technology to accommodate surface mounted passives imposes certain limits on board design which constrain the overall system speed. Embedding passives is one way to minimize the functional footprint while at the same time improving performance. The purpose of this paper is to describe the development of a thin film technology based on ferroelectric‐epoxy polymer‐based flake‐free resin coated copper capacitive (RC3) nanocomposites to manufacture multilayer embedded capacitors.Design/methodology/approachThis paper discusses thin film technology based on RC3 nanocomposites. In particular, recent developments in high capacitance, large area, thin film passives, and their integration in system in a package (SiP) are highlighted.FindingsA variety of RC3 nanocomposite thin films ranging from 8 to 50 microns thick were processed on copper substrates by liquid coating. Multilayer embedded capacitors resulted in high capacitances of 16‐28 nF. The fabricated test vehicle also included two embedded resistor layers with resistances in the range of 15 Ω to 100 kΩ. To enable high performance devices, an embedded resistor must meet certain tolerances. The embedded resistors can be laser trimmed to a tolerance of Research limitations/implicationsThis case study designed and fabricated an eight layer high density internal passive core and subsequently applied fine geometry three buildup layers to form a 3‐8‐3 structure. The passive core technology is capable of providing up to six layers of embedded capacitance and could be extended further.Originality/valueA thin film technology based on ferroelectric‐epoxy polymer‐based flake‐free RC3 nanocomposites was developed to manufacture multilayer embedded capacitors. The overall approach lends itself to package miniaturization because capacitance can be increased through multiple layers and reduced thickness to give the desired values in a smaller area. |
