A Zero X‐Y Shrinkage Low Temperature Cofired Ceramic Substrate Using Ag and AgPd Conductors for Flip‐chip Bonding*
| Autor: | M. Itagaki, Kazuo Eda, Toru Ishida, Yoshihiro Bessho |
|---|---|
| Rok vydání: | 1997 |
| Předmět: |
Materials science
business.industry Substrate (electronics) Condensed Matter Physics Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials Conductor Plating visual_art Electronic engineering visual_art.visual_art_medium Microelectronics Ceramic Electrical and Electronic Engineering Composite material business Electrical conductor Flip chip Shrinkage |
| Zdroj: | Microelectronics International. 14:15-18 |
| ISSN: | 1356-5362 |
| DOI: | 10.1108/13565369710195315 |
| Popis: | A zero X‐Y shrinkage low temperature cofired ceramic (LTCC) substrate was developed, which was applied to flip‐chip bonded chip‐size packages (CSPs) and multichip modules (MCMs). The Ag internal conductor, the AgPd external conductor and the newly developed Ag via conductor could be used by matching the sintering shrinkage behaviour with that of the zero X‐Y shrinkage LTCC substrate. Flip‐chip bonding using the stud‐bump ‐bonding (SBB) technique could be performed on this substrate without Au plating on the external conductor. Stable flip‐chip bondability was obtained. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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