A Laser Dicing Method for Plus-Shaped Dies for Heterogenous Integration Applications

Autor: Aakrati Jain, Kamal Sikka, Shidong Li, Juan-Manuel Gomez, Marc Bergendahl, Spyridon Skordas, Jeroen Van Borkulo, Roman Doll, Kees Biesheuvel, Mark Mueller
Rok vydání: 2022
Zdroj: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Databáze: OpenAIRE