Dislocation Activity and Slip Analysis Contributing to Grain Boundary Sliding and Damage during Thermomechanical Fatigue in Dual Shear Lead-Free Solder Joint Specimens

Autor:	Adwait U. Telang, Thomas R. Bieler
Rok vydání:	2005
DOI:	10.4028/3-908451-09-4.219
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::fd1b3dc27d9988a38604f0e6dfbf3ca5 https://doi.org/10.4028/3-908451-09-4.219 Zobrazit plný text záznamu