Micro-machined 3D Cube Antenna for X-Band Communication ICs
| Autor: | Noah Sauber, Robert M. Weikle, N. Scott Barker, Han-Yu Tsao, Yuxin Wang, Arthur W. Lichtenberger |
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| Rok vydání: | 2021 |
| Předmět: |
Materials science
Plane (geometry) business.industry X band 020206 networking & telecommunications 02 engineering and technology Computer Science::Hardware Architecture Optics CMOS Balun 0202 electrical engineering electronic engineering information engineering Integrated circuit packaging Antenna (radio) Cube Reflection coefficient business Computer Science::Information Theory |
| Zdroj: | 2021 IEEE 21st Annual Wireless and Microwave Technology Conference (WAMICON). |
| DOI: | 10.1109/wamicon47156.2021.9443599 |
| Popis: | A 3D cube antenna for CMOS communication ICs is proposed in this paper. The antenna is fabricated on the surface of a cube for the interior CMOS chip placement. The antenna system consists of a meandered line antenna plated gold on three silicon planes of the cube and a balun on one plane. Three planes are then connected and folded by gold, and fixed in a plastic carrier. This antenna is designed for X-band receivers (8-12 GHz) and its measured peak gain is -$1.38\mathrm{d}\mathrm{B}\mathrm{i}$ with 7% -$10\mathrm{d}\mathrm{B}$ reflection coefficient at 10.35 GHz. The antenna cube interior size is 3 $\mathrm{m}\mathrm{m}\times 3\mathrm{m}\mathrm{m}\times 3$ mm, of which the cubic shape allows for CMOS IC packaging inside the cube’s hollow interior. |
| Databáze: | OpenAIRE |
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