| Autor: |
M. Kohl, T. Cuntz, T. Grund |
| Rok vydání: |
2008 |
| Předmět: |
|
| Zdroj: |
2008 IEEE 21st International Conference on Micro Electro Mechanical Systems. |
| ISSN: |
1084-6999 |
| DOI: |
10.1109/memsys.2008.4443683 |
| Popis: |
This paper introduces the technologies of ultrasonic welding and heat-activated bonding for batch integration of micromachined polymer layers and shape memory alloy (SMA) foils or films. A series of ultrasonic welding tests is performed to achieve matter-free bonds on the wafer level with vertical accuracy of 1 mum. Heat-activated bonding is tested for various pressure and temperature conditions using micromachined foils of 60 mum thickness. The technologies are combined in a new process flow for batch fabrication of mechanically active polymer microsystems. The process flow is validated by the fabrication and characterization of SMA-actuated polymer microvalves. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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