Autor: |
Chih-Huang Lai, Cheng-Han Yang, T. K. Tseng, Yun-Chung Wu |
Rok vydání: |
2006 |
Předmět: |
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Zdroj: |
Journal of Magnetism and Magnetic Materials. 304:e237-e239 |
ISSN: |
0304-8853 |
DOI: |
10.1016/j.jmmm.2006.01.176 |
Popis: |
(0 0 1)-orientation FePt films were successfully fabricated on hydrogen-terminated Si(1 0 0) substrates by inserting Cu underlayers. By using the Co intermediate layer to suppress the diffusion of Cu and Si, the perpendicular coercivity reaches 6500 Oe after 300 °C postannealing. The dynamic-stress-induced ordering by the formation of Cu 3 Si was the main reason for high coercivity. To improve the perpendicular anisotropy, Cu/CoFe/Ag composite underlayer was used. The large lattice constant of Ag provided a sufficient in-plane tensile static stress in FePt films. Both large perpendicular coercivity (8200 Oe) and good perpendicular squareness (∼0.9) were achieved for samples deposited at 300 °C. |
Databáze: |
OpenAIRE |
Externí odkaz: |
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