Automated Detection of Micro Void in Solder Bump
| Autor: | Atsushi Teramoto, Hiroshi Fujita, Masatoshi Tsuzaka, Takayuki Murakoshi |
|---|---|
| Rok vydání: | 2006 |
| Předmět: |
Void (astronomy)
Materials science Soldering Acoustics ComputerSystemsOrganization_COMPUTER-COMMUNICATIONNETWORKS Subtraction Electronic engineering Noise elimination Image subtraction Electrical and Electronic Engineering Linear discriminant analysis Industrial and Manufacturing Engineering Flip chip |
| Zdroj: | IEEJ Transactions on Industry Applications. 126:1514-1521 |
| ISSN: | 1348-8163 0913-6339 |
| DOI: | 10.1541/ieejias.126.1514 |
| Popis: | In the flip chip junction, void in the solder bump has serious influences on reliability and electric characteristic. In this paper, we propose an automated detection technique of micro voids in solder bump. The void makes hollow on the bump shape in X-ray image. We developed subtraction-based method by means of combination of morphology filter and image subtraction to detect the voids. Furthermore, we introduced noise elimination method using some void feature values and discriminant analysis. We evaluated this technique using simulation model and real bump. As a result, a correct rate reached 99.2%, which demonstrates this technique has very high detection ability. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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