Printability and actinic AIMS review of programmed mask blank defects
Autor: | Shravan Matham, Daniel Corliss, Jed H. Rankin, Erik Verduijn, Pawitter Mangat, Nelson Felix, Dirk Hellweg, Obert Wood, Renzo Capelli, Sascha Perlitz, Yulu Chen, Francis Goodwin, Ravi K. Bonam |
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Rok vydání: | 2017 |
Předmět: |
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Materials science business.industry Extreme ultraviolet lithography 02 engineering and technology Substrate (printing) 021001 nanoscience & nanotechnology 01 natural sciences Blank 010309 optics Optics Resist 0103 physical sciences Wafer Transfer model 0210 nano-technology business Lithography |
Zdroj: | SPIE Proceedings. |
ISSN: | 0277-786X |
Popis: | We report on the printability, mitigation and actinic mask level review of programmed substrate blank pit and bump defects in a EUV lithography test mask. We show the wafer printing behavior of these defects exposed with an NXE:3300 EUV lithography scanner and the corresponding mask level actinic review using the AIMSTM tool. We will show which categories of these blank substrate defects print on wafer and how they can be mitigated by hiding these defects under absorber lines. Furthermore we show that actinic AIMSTM mask review images of these defects, in combination with a simple thresholded resist transfer model, can accurately predict their wafer printing profiles. We also compare mask level actinic AIMSTM to top down mask SEM review in their ability to detect these defects. |
Databáze: | OpenAIRE |
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