A New Cleaning Technology Using the Effect of Freezing Water on Wafer Surface

Autor:	Masahiko Kato, Akira Izumi, Naozumi Fujiwara, Katsuhiko Miya
Rok vydání:	2011
Předmět:	Surface (mathematics) Materials science Wafer Composite material
Zdroj:	ECS Transactions. 41:215-220
ISSN:	1938-6737 1938-5862
DOI:	10.1149/1.3630846
Popis:	In this paper, effectiveness of freezing process on particle removal efficiency (PRE) for various sizes and polycrystalline silicon line damages was studied by a method which consists of freezing and melting water film on the wafer. It was found that this sequence, freezing and melting process, could remove particles, especially for small-sized particles (e.g. 40-nm particles) with high efficiency, without any damages on 37-nm polycrystalline silicon lines and material loss.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::fc01ee2a65e345eb315f4006bf41a6fa https://doi.org/10.1149/1.3630846 Zobrazit plný text záznamu