Critical parameters for achieving optimum reflow profiles for plastic package preconditioning

Autor:	C.K. Yoon, Ki-il Hong, S. Daniel, Young-Wug Kim, Sang-Woon Lee
Rok vydání:	1995
Předmět:	Surface-mount technology Convection Reflow soldering Materials science Soldering Delamination Heat transfer Electronic packaging Electronic engineering Integrated circuit packaging Composite material
Zdroj:	33rd IEEE International Reliability Physics Symposium.
DOI:	10.1109/relphy.1995.513659
Popis:	Temperature profiles of surface mount components progressing through convection and infrared reflow systems are studied with respect to package size, inter-component spacing, and loading density. For constant forcing temperature, T/sub max/ varies inversely with component mass. A minimum component spacing required to minimize T/sub max/ variation is established. Package delamination and cracking are shown to depend primarily on T/sub max/.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::fbcdccc12fe967817f615fcba33da2ac https://doi.org/10.1109/relphy.1995.513659 Zobrazit plný text záznamu