Enabling wet etch process for TSV reveal high-volume manufacturing

Autor:	John Clark, Laura Mauer, John Taddei, Erwan Le Roy
Rok vydání:	2015
Předmět:	Materials science Silicon Packaging engineering Through-silicon via business.industry Process (computing) chemistry.chemical_element High volume manufacturing Semiconductor industry chemistry Etching (microfabrication) Electronic engineering business Process engineering
Zdroj:	2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Popis:	2.5D and 3D packaging continues to be a popular topic within the semiconductor industry. Several announcements have shown signs of adoption for the new packaging technology, especially for stacked DRAMi. The reveal of the Through Silicon Via (TSV) is a critical step within this packaging integration sequence. However, the biggest challenge delaying high-volume manufacturing is the cost. This article presents a two-step wet etch technique as an economical process for achieving uniformly revealed vias.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::fba33dd3980bd09ecea48f785d552a8c https://doi.org/10.1109/impact.2015.7365257 Zobrazit plný text záznamu