Strain Measurements and Thermo-Mechanical Simulation of SnAgCu vs. low melting point alloy (LMPA-Q) solder joints

Autor:	Bart Vandevelde, Riet Labie, Ralph Lauwaert, Rainer Dudek, Przemyslaw Gromala, Michael Eichorst
Rok vydání:	2023
Zdroj:	2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::fb036dc1720277aed4d5d75030e9f27b https://doi.org/10.1109/eurosime56861.2023.10100841 Zobrazit plný text záznamu