| Autor: |
John B. Macdonald, Howard N. Gaston, Israel Amir, Rodney E. Griffin, Frank P. Higgins |
| Rok vydání: |
1992 |
| Předmět: |
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| Zdroj: |
AT&T Technical Journal. 71:30-36 |
| ISSN: |
8756-2324 |
| DOI: |
10.1002/j.1538-7305.1992.tb00171.x |
| Popis: |
A major barrier to improved process control in electronic circuit-pack assembly is the lack of robust, high-speed, cost-effective sensing technologies. As part of an overall process-control system, AT&T's Little Rock (Arkansas) Operations Center is implementing a new three-dimensional (3-D) imaging system that measures the amount of solder paste applied to circuit boards. The system uses an imaging technique that can measure the solder-paste volume of each site on a circuit board at production rates. Our investigation shows that solder-paste volume is an important process-control parameter for high-quality circuit board assembly. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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