Thermal and Mechanical Considerations for Silicon-Resin High-Density Substrate
| Autor: | B. Smith, Andrew J. Mueller, Jeffrey C. Thompson, Livia M. Racz, P. Kwok |
|---|---|
| Rok vydání: | 2012 |
| Předmět: |
Interconnection
Materials science Fabrication Silicon Composite number technology industry and agriculture chemistry.chemical_element Industrial and Manufacturing Engineering Finite element method Electronic Optical and Magnetic Materials law.invention Material selection chemistry law Hardware_INTEGRATEDCIRCUITS Electronic engineering Wafer Electrical and Electronic Engineering Photolithography Composite material |
| Zdroj: | IEEE Transactions on Components, Packaging and Manufacturing Technology. 2:1092-1098 |
| ISSN: | 2156-3985 2156-3950 |
| DOI: | 10.1109/tcpmt.2012.2198645 |
| Popis: | We examine the thermomechanical tradeoffs in a novel technology for high-density interconnect substrates. Fabricated from silicon (Si) wafers with planar cavities of highly filled composite encapsulant, the technology leverages established Si photolithography but offers improved mechanical properties. Modules are subject to thermomechanical stress during encapsulant cure, assembly reflow, module fabrication, and operation. We show that improvements in junction-to-ambient sinking offset the heat density increase in such systems and low expansion encapsulants prevent failure during cure and subsequent processing. We employ finite element modeling and materials testing to show the effect of wafer design and material selection on the in-plane and through-plane stresses in the module. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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