| Popis: |
To extend optical lithography technology to the sub-100 nm linewidth regime, all mask-related distortions must be eliminated or minimized. Thermal distortion during the exposure process can be a significant contribution to the total pattern placement error budget for advanced photomasks. Consequently, several finite element (FE) models were developed to predict the thermal and the mechanical response of the optical reticle during exposure. This paper presents the experimental verification of the FE thermal models. In particular, the results of the numerical simulation were compared with the experimental data and excellent agreement was found. |
