The effects of cracks on the thermal stress induced by soldering in monocrystalline silicon cells

Autor:	Chi Ming Lai, Keh-Moh Lin, Chi Hung Su
Rok vydání:	2013
Předmět:	Materials science Silicon Mechanical Engineering Metallurgy chemistry.chemical_element Aspect ratio (image) Industrial and Manufacturing Engineering Rod Monocrystalline silicon chemistry Breakage Residual stress Soldering Composite material Stress intensity factor
Zdroj:	Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering. 228:127-135
ISSN:	2041-3009 0954-4089
DOI:	10.1177/0954408913487285
Popis:	Silicon-based solar applications have tended towards the use of large, thin cells. However, an increased loss of materials occurs due to a high rate of destruction during the soldering and packaging processes. In this study, the effects of the presence of cracks on the thermal stress and stress intensity factor of the cells were explored for different aspect ratios of the soldering rods using an established finite element method. It was found that the residual stress in the cell was concentrated near the ends of the soldering rods, which coincided with the typical positions where breakage tended to occur on the cell. The residual stress on the cell increased with an increasing aspect ratio of the soldering rod. Cell damage due to cracking can be avoided by controlling the magnitude of the soldering rod’s aspect ratio.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::fa41fc6ecc293433f11be700b3e84d79 https://doi.org/10.1177/0954408913487285 Zobrazit plný text záznamu