Wafer level analysis and simulation of back end of line chemical mechanical polishing processes
| Autor: | Ushasree Katakamsetty, Stefan Voykov, Sascha Bott, Sam Nakagawa, Tamba Gbondo-Tugbawa, Aaron Gower-Hall, Brian Lee, Jansen Chee, Henry Geng, Weiyang Zhu, Bifeng Li, Kimiko Ichikawa |
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| Rok vydání: | 2022 |
| Zdroj: | DTCO and Computational Patterning. |
| Databáze: | OpenAIRE |
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