Experimental study of through glass via effects on high frequency electrical characteristics
| Autor: | Junichi Suyama, Yumi Okazaki, Masaya Tanaka, Osamu Horiuchi, Yoshihisa Katoh, Satoru Kuramochi, Younggun Han |
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| Rok vydání: | 2018 |
| Předmět: |
010302 applied physics
Materials science Acoustics 020206 networking & telecommunications 02 engineering and technology 01 natural sciences Line (electrical engineering) Radio spectrum Transmission line 0103 physical sciences 0202 electrical engineering electronic engineering information engineering Object-relational impedance mismatch Electrical performance Insertion loss |
| Zdroj: | 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC). |
| DOI: | 10.23919/icep.2018.8374699 |
| Popis: | We study the influence of high frequency characteristics of the through glass via (TGV) and the transmission line on glass for high frequency bands. We designed an evaluation pattern combining a transmission line with some length and TGV, and we formed the test pattern with semi-additive plating (SAP) process. Line design rule defined by electro-magnetic simulation analysis, and we devised measurement pad design to minimize the influence of impedance mismatch on measurement pad location. Through this evaluation, we demonstrated electrical performance of coplanar waveguides (CPWs) with TGV on glass. Insertion loss increasing caused by TGV was about 0.2dB at 30GHz on CPWs. As the result, we considered that the line with TGV can be applicable to high frequency bands. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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