Study of n-on-p sensors breakdown in presence of dielectrics placed on top surface
| Autor: | Z. Luce, Yoshinobu Unno, M. Gignac, Vitaliy Fadeyev, Luise Poley, A. A. Affolder, C. Helling, S. Kachiguine, Z. Galloway |
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| Rok vydání: | 2019 |
| Předmět: |
Physics
Nuclear and High Energy Physics Silicon 010308 nuclear & particles physics business.industry chemistry.chemical_element Temperature cycling Dielectric 01 natural sciences Radiation length Flexible electronics 030218 nuclear medicine & medical imaging 03 medical and health sciences 0302 clinical medicine chemistry 13. Climate action 0103 physical sciences Optoelectronics Breakdown voltage Adhesive business GLUE Instrumentation |
| Zdroj: | Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment. 924:147-152 |
| ISSN: | 0168-9002 |
| Popis: | The ATLAS upgrade strip module design has readout flex circuits glued directly on top of the sensor’s active area to facilitate the assembly process and minimize the radiation length. The process requires radiation-hard adhesives compatible with the sensor technology. We report on the studies of the breakdown behavior with miniature versions of the prototype sensors, where candidate adhesives were placed in several locations on top of the sensor, including the strip area, guard ring region, and sensor edge. Thermal cycling tends to attenuate the observed cases of breakdown with glue on top of the guard ring. Glue reaching the sensor edge results in low breakdown voltage if it also covers AC- or DC- pads or bias ring openings. Glue placement on top of guard ring region was performed on a large-format sensor, with generally similar results to the miniature sensor tests, except for a large glue deposition, which resulted in a permanent reduction of the breakdown voltage. Post-irradiation measurements were performed for some of the glues deposited on top of the strip area, without any sign of the early breakdown. To help rank the candidate glue, we studied them with differential scanning calorimetry to find the glass transition and degree of curing. |
| Databáze: | OpenAIRE |
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