Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect
| Autor: | C.Z. Liu, J. J. Wang, T.Y. Kang, Y. Y. Xiu, W.P. Tong, L. Hui |
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| Rok vydání: | 2011 |
| Předmět: |
Interconnection
Materials science Polymers and Plastics business.industry Growth kinetics Mechanical Engineering Metallurgy Metals and Alloys Intermetallic chemistry.chemical_element Activation energy Bi element Bismuth chemistry Mechanics of Materials Soldering Materials Chemistry Ceramics and Composites Microelectronics business |
| Zdroj: | Journal of Materials Science & Technology. 27:741-745 |
| ISSN: | 1005-0302 |
| DOI: | 10.1016/s1005-0302(11)60136-9 |
| Popis: | The intermetallic compound (IMC) growth kinetics in pure Sn/Cu and Sn10 wt%Bi/Cu solder joints was studied, respectively, after they were aged at 160–210°C for different time. It was found that the total IMC in SnlO wt%Bi/Cu joint developed faster than it did in pure Sn/Cu solder joint, when they were aged at the same temperature. And the activation energy Q a for total IMC in Sn10 wt%Bi/Cu joint was lower than that for pure Sn/Cu interconnect. The IMC growth process was discussed. The IMC Cu 6 Sn 5 was enhanced in compensation of reduced IMC Cu 3 Sn growth. The work reveals that Bi element containing in lead free solder alloys with 10 wt% can enhance IMC growth in lead free solder/Cu joint during service. |
| Databáze: | OpenAIRE |
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