The effects of the decreasing joint size on interfacial microstructure and shear behavior of micro-scale BGA structure Cu/Sn–3.0Ag–0.5Cu/Cu joints under coupled electromechanical loads

Autor:	W. K. Le, M. B. Zhou, X. P. Zhang
Rok vydání:	2022
Předmět:	Electrical and Electronic Engineering Condensed Matter Physics Atomic and Molecular Physics and Optics Electronic Optical and Magnetic Materials
Zdroj:	Journal of Materials Science: Materials in Electronics. 33:1464-1479
ISSN:	1573-482X 0957-4522
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::f8c1c75057e335323f39629b73207271 https://doi.org/10.1007/s10854-021-07638-z Zobrazit plný text záznamu Full text from SpringerLink