Effective Computational Models for Addressing Asymmetric Warping of Fan-Out Reconstituted Wafer Packaging

Autor:	Yu-Chin Lee, Chia-Yu Chen, Kuo-Shen Chen, Jen-Hsien Wong, Wei-Hong Lai, Tang-Yuan Chen, Dao-Long Chen, David Tarng
Rok vydání:	2022
Zdroj:	2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::f8497ce172a170a7ca82398671f61c93 https://doi.org/10.1109/ectc51906.2022.00172 Zobrazit plný text záznamu