A simple and green strategy for preparing flexible thermoplastic polyimide foams with exceptional mechanical, thermal-insulating properties, and temperature resistance for high-temperature lightweight composite sandwich structures
| Autor: | Xupeng Fan, Junjun Song, Liwei Zhao, Liu Changwei, Chunhai Chen, Huikang Xu, Yubo Wang, Gang Li, Cui Baojun, Haitao Zhang, Daoxiang Zhao, Xiao Zhang, Chen Weijun, Daming Wang |
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| Rok vydání: | 2022 |
| Předmět: |
chemistry.chemical_classification
Specific modulus Thermoplastic Materials science business.industry Mechanical Engineering Composite number Modulus Industrial and Manufacturing Engineering Compressive strength chemistry Mechanics of Materials Ceramics and Composites Microelectronics Composite material business Porosity Polyimide |
| Zdroj: | Composites Part B: Engineering. 228:109405 |
| ISSN: | 1359-8368 |
| DOI: | 10.1016/j.compositesb.2021.109405 |
| Popis: | Polyimide (PI) foams possess excellent mechanical properties, high-temperature resistance, and other unique properties, which facilitate impact in aerospace, automotive, and microelectronics industries. However, when they are used as lightweight insulation structural layers for high-temperature carbon fiber reinforced composites, improvement in thermal-insulating properties and temperature resistance of PI foams without compromising the flexibility in extreme environments is a challenging task. In this study, the flexible blocks were linked into rigid polymeric structures to fabricate a thermoplastic structure through a simple aqueous strategy to construct hydrogen-bonding networks. Thus, with a low shrinkage of 8.42%, an ultrahigh compressive modulus of 11.17 MPa, and a specific modulus of 81.03 MPa cm3 g−1 was successfully achieved. Benefitting from the formation of ultra-strong network backbones, foams showed excellent thermal-insulating properties and temperature resistance. The robust porous material with thermal-insulating properties (0.0481 W m−1 K−1) exhibited a compression modulus of 4.21 MPa after heat treatment at 300 °C and maintained 91% strength retention, thus it can be used as lightweight heat-insulation composite sandwich structures up to 300 °C. The copolymer foam obtained by using 30 mol% flexible blocks reserves its high flexibility undergoing only 10% dimensional changes after 40,000 compression-release cycles. The lightweight thermoplastic PI foams with flexibility, thermal-insulating properties, and temperature resistance can be used for high-temperature lightweight composite sandwich structures in aeronautics and space exploration. |
| Databáze: | OpenAIRE |
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