| Autor: |
R.W. Messier, C.H. Raeder, L.E. Felton, L.F. Coffin |
| Rok vydání: |
2002 |
| Předmět: |
|
| Zdroj: |
Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'. |
| DOI: |
10.1109/iemt.1995.526124 |
| Popis: |
This study details a thermomechanical testing technique, used in an on-going program, to measure stress-strain hysteresis of solder joints. The apparatus closely approximates the mechanical conditions solder joints experience in electronics packages subjected to cyclic temperature changes. The test assembly is composed of a small load frame, an insert of differing thermal expansion coefficient, and a solder joint. Strain gages on the load frame and a calibration procedure conducted prior to testing allow shearing stress and strain in the solder joint to be obtained during testing. Some thermomechanical deformation behavior of SnBi eutectic solder is reported and discussed. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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