Autor: |
Ronald N. Miles, C. Gibbons, Weili Cui, N. C. Tien, Kyutae Yoo, Quang T. Su, J.-L.A. Yeh |
Rok vydání: |
2001 |
Předmět: |
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Zdroj: |
Transducers ’01 Eurosensors XV ISBN: 9783540421504 |
DOI: |
10.1007/978-3-642-59497-7_30 |
Popis: |
This paper reports a new approach to the fabrication of 3D structured diaphragms using integrated surface and deep reactive ion etching (DRIE) bulk silicon micromachining on a silicon-on-insulator (SOI) wafer. The fabrication process has been applied to a 1 mm × 2 mm × 1.2 µn diaphragm designed for a biomimetic directional microphone. The membrane has two 200 µm × 380 µm × 20 µm silicon proof masses, solid stiffeners, and a 20 µm deep corrugation. Acoustic measurements of the diaphragm using laser vibrometry have demonstrated high directional sensitivity of the device. |
Databáze: |
OpenAIRE |
Externí odkaz: |
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