Microstructure and properties of copper thick-films over aluminium nitride substrates: optimization of a nitrogen based atmosphere

Autor:	Claude Lucat, Dominique Navarro, S. Mellul, P. Massiot, A. Charpentier
Rok vydání:	2002
Předmět:	Atmosphere chemistry.chemical_compound Materials science chemistry Electrical resistivity and conductivity Aluminium nitride Metallurgy chemistry.chemical_element Adhesion Microstructure Oxygen Nitrogen Copper
Zdroj:	8th IEEE/CHMT International Conference on Electronic Manufacturing Technology Symposium.
DOI:	10.1109/iemt8.1990.171065
Popis:	In order to improve the characteristics of copper thick film over aluminium nitride substrates, the authors studied the effects of oxygen additions to the nitrogen atmosphere of the furnace, at the level of the burnout zone. Experiments were carried out on both as-received and preoxidized AlN substrates. Scanning-electron-microscope examination of the copper film's microstructure and electron probe microanalysis were carried out on copper thick-film/AlN cross sections and correlated with properties such as adhesion and resistivity, allowing the establishment of ideal firing atmosphere conditions for the manufacture of copper thick films over AlN. >
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::f7e9d3aeb7605b5fa0e451728f81628f https://doi.org/10.1109/iemt8.1990.171065 Zobrazit plný text záznamu