Effect of TIM Deterioration on Monitoring of IGBT Module Thermal Resistance and Its Compensation Strategy

Autor:	Jie Cai, Luowei Zhou, Pengju Sun, Te Zhou, Qiang Li
Rok vydání:	2022
Předmět:	Electrical and Electronic Engineering Industrial and Manufacturing Engineering Electronic Optical and Magnetic Materials
Zdroj:	IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:789-797
ISSN:	2156-3985 2156-3950
DOI:	10.1109/tcpmt.2022.3169156
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::f78b952e49fed90f8b2f90fb0112ba1b https://doi.org/10.1109/tcpmt.2022.3169156 Zobrazit plný text záznamu