The Initial Stages of Copper Deposition on Bare and Chemically Modified Gold Electrodes

Autor:	Dieter M. Kolb, M. A. Schneeweiss
Rok vydání:	1999
Předmět:	Chemical engineering Chemistry Monolayer Electrode Ion plating Nucleation Mineralogy Electrolyte Substrate (electronics) Overpotential Condensed Matter Physics Deposition (chemistry) Electronic Optical and Magnetic Materials
Zdroj:	physica status solidi (a). 173:51-71
ISSN:	1521-396X 0031-8965
DOI:	10.1002/(sici)1521-396x(199905)173:1<51::aid-pssa51>3.0.co;2-o
Popis:	This paper comprises, in the form of an overview, various aspects of the initial stages of electrolytic metal deposition, demonstrated and exemplified by the classical model system, Cu on Au(hkl). Describing underpotential as well as overpotential deposition, some of the parameters governing nucleation and growth are pointed out. The profound effect of substrate orientation is shown and various examples of the influence of organic additives on the deposition process are given. Most recently, metal deposition onto electrodes covered with self-assembled monolayers has received increased attention as a possible model system for metal deposition onto a non-conducting stirface and therefore, preliminary results for Cu deposition on alkanethiol covered Au(111) are presented.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::f76e61211f9ddf1218250ff9c39d6cd4 https://doi.org/10.1002/(sici)1521-396x(199905)173:1<51::aid-pssa51>3.0.co Zobrazit plný text záznamu Plný text