Void Growth Analysis of Flip-Chip Solder Joint by Using Electromigration Failure Simulation and Synchrotron Radiation X-Ray Microtomography

Autor:	Masaru Fujiyoshi, Yu Harubeppu, Hisashi Tanie, Hiroshi Shintani, Nobuhiko Chiwata, Shinichi Fujiwara
Rok vydání:	2012
Předmět:	Void (astronomy) Crystallography X-ray microtomography Materials science Soldering Synchrotron radiation Electrical and Electronic Engineering Composite material Electromigration Flip chip
Zdroj:	Journal of The Japan Institute of Electronics Packaging. 15:541-549
ISSN:	1884-121X 1343-9677
DOI:	10.5104/jiep.15.541
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::f732664c86e5e942b4fcb084173c05f6 https://doi.org/10.5104/jiep.15.541 Zobrazit plný text záznamu