Thermal Cycling Study of Electrodeposited Sn–Ni and In–Ni Alloys

Autor:	A. S. Gak, M. S. Mikhailova, V. A. Fedorov, I. N. Petukhov, V. M. Roshchin
Rok vydání:	2020
Předmět:	010302 applied physics Chemical substance Materials science General Chemical Engineering Metallurgy Metals and Alloys chemistry.chemical_element 02 engineering and technology Temperature cycling 021001 nanoscience & nanotechnology Electrochemistry 01 natural sciences Inorganic Chemistry Nickel chemistry Soldering 0103 physical sciences Materials Chemistry Melting point Gravimetric analysis 0210 nano-technology Deposition (law)
Zdroj:	Inorganic Materials. 56:254-257
ISSN:	1608-3172 0020-1685
DOI:	10.1134/s0020168520030176
Popis:	We report the electrochemical deposition of Sn–Ni and In–Ni alloys containing 20 and 45 wt % of the lower melting point component. The percentage of nickel in the deposited alloys has been determined by gravimetric analysis. We have studied the thermal behavior of the deposited materials in heating–cooling cycles in the temperature ranges 50–250, 50–300, and 50–400°C. The results of this study can be useful in high-density mounting using Pb-free solder materials with a preset soldering temperature.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::f7312bd56c49c4f1c1073092fdf41635 https://doi.org/10.1134/s0020168520030176 Zobrazit plný text záznamu Plný text ve formátu PDF Plný text ve formátu HTML
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