Results of Production Thermal Cycle Screening
| Autor: | R. E. Kuehn |
|---|---|
| Rok vydání: | 1974 |
| Předmět: |
Engineering
business.industry Thermal cycle Hardware_PERFORMANCEANDRELIABILITY Integrated circuit Thermal management of electronic devices and systems law.invention Reliability engineering Field experience law Hardware_INTEGRATEDCIRCUITS Production (economics) Electrical and Electronic Engineering Safety Risk Reliability and Quality business |
| Zdroj: | IEEE Transactions on Reliability. :273-276 |
| ISSN: | 1558-1721 0018-9529 |
| DOI: | 10.1109/tr.1974.5215271 |
| Popis: | The results of a large-scale production thermal-cycle screen at the system-level and the failure distribution at the piece-part level and at the failure-mechanism level of integrated circuits are given. The effectiveness of the thermal-cycle screen is discussed at both the system and integrated-circuit level. Failure rates for integrated-circuit failure mechanisms are compared for the thermal-cycle screen and field experience. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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